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Smart Audio Products & High Quality Audio ... - Qualcomm
https://www.qualcomm.com/products/audio
Qualcomm® QCC3050 is an ultra-low power, single-chip solution, optimized for use in truly wireless earbuds and designed to support Qualcomm® Snapdragon Sound™ Technology. Smart Audio 400 Platform Designed to bring together the building blocks for developing a smart speaker in a single, flexible platform that helps reduce product development time and complexity.
All Products and Platforms | Chipsets and SoCs | …
https://www.qualcomm.com/products
Qualcomm’s product catalog includes integrated processors, chipsets, SoCs, and SDKs: everything you need to build cutting-edge devices and applications with best-in-class connectivity and technology engineering.
Overview | QCC5144 Chipset - Qualcomm
https://www.qualcomm.com/products/qcc5144
Qualcomm® QCC5144 is optimized for use in earbuds and hearables, this premium tier single-chip solution is designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* and comfort, integrated Qualcomm® Active Noise Cancellation technology (ANC), Voice Assistant support (including wake-word activation), and Qualcomm …
Qualcomm SA6155P Product Brief
https://www.qualcomm.com/media/documents/files/qualcomm-sa6155p-product-brief.pdf
It is a 11nm system-on-chip (SOC) designed with custom hardware blocks including: Qualcomm SA6155P, Qualcomm Adreno, Qualcomm FlexRender, Qualcomm Kryo and Qualcomm SirfStar are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Note: Some features are optional based on the product variant. Qualcomm® SA6155P Product Brief
Overview | QCC3008 | Qualcomm
https://www.qualcomm.com/products/qcc3008
The QCC3008 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices. The …
Product Listings: Chipsets and SoCs for ... - Qualcomm
https://www.qualcomm.com/products/audio/bluetooth-and-wireless-speakers/product-list
Qualcomm QCC5151 flagship bluetooth audio SoC adopted by ...
https://www.qucox.com/qualcomm-qcc5151-soc/
Qualcomm QCC5151 adopts WLCSP package, 4*4mm-94pin, supports bluetooth 5.2, and is designed to support the new generation of bluetooth audio technology standard LE Audio. The chip has a built-in quad-core processor, dual-core 80MHz 32-bit application subsystem, dual-core 120MHz programmable Qualcomm Kalimba DSP audio subsystem, DSP …
Qualcomm Upgrades Bluetooth Audio Chips to Take on …
https://www.electronicdesign.com/technologies/embedded-revolution/article/21129812/qualcomm-upgrades-bluetooth-audio-chips-to-take-on-apples-airpods
Qualcomm released another audio chipset, the QCC514x, for high-end wireless earbuds. The Bluetooth audio chip pumps out more performance and reduces power consumption compared to its predecessors....
Qualcomm's latest earbud chip is built for Bluetooth LE …
https://www.engadget.com/qualcomm-qcc305x-earbud-soc-bluetooth-le-audio-160053257.html
Today, Qualcomm announced its QCC305x SoC, a true wireless earbud chip that’s properly equipped for Bluetooth LE Audio. Indeed, the QCC305x brings a host of handy features to more true wireless...
Qualcomm Announces QCC514X and QCC304X Audio Chips with ...
https://optocrypto.com/qualcomm-announces-qcc514x-and-qcc304x-audio-chips-with-new-truewireless-mirroring-technology/
Qualcomm has improved its audio chips over the years and is now entering the third phase of the development of its wireless headset technology, which will extend from 2020 to 2024. The two new audio chips are the Qualcomm QCC514X (high-end) and QCC304X (low- and mid-range), both of which incorporate the new TrueWireless Mirroring technology.
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